Purpose of the position
Foxconn Technology Group, a global electronics manufacturing leader, seeks a Process Improvement Engineer to drive operational reliability and product quality by leading BGA rework equipment programming, maintenance protocols, and Control-run-managed process optimization. Responsibilities include standard operating procedure standardization, yield-driven problem resolution, client inquiry management, FACA analysis reporting, and PDCA-driven improvements to eliminate defects and boost repair efficiency.
Duties And Responsibilities
- Dynamically adjust BGA rework equipment parameters based on product requirements to ensure precision, and validate equipment stability in real-time
- Perform BGA device cleaning, component inspections, and preventive maintenance, document anomalies, and drive rapid fixes to avoid downtime
- Design standardized workflows for diverse components and validate feasibility through hands-on testing
- Analyze Control-Run project yield data and bottlenecks, implement improvement plans, and align outputs with customer specifications
- Aggregate monthly PDCA results (e.g., efficiency gains, cost optimizations), analyze gaps, plan next steps, and communicate progress to clients to address technical queries, ensure compliance, and strengthen trust
- Adhere to company policies and Standard Operating Procedures in all operational workflows
Education And Work Experience
- Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electrical Automation Engineering
- 3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors
Working conditions
- Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork
- Employees are continuously encouraged to learn and grow their careers in smart manufacturing
Skills:
- End-to-end electronics manufacturing expertise with hands-on SMT assembly and wave soldering optimization to resolve production bottlenecks and drive process efficiency
- Proficiency in SMT IPC standards and PCB manufacturing processes to design quality-driven solutions, ensure compliance, and optimize production workflows
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